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New RF Front-end Module From SST Communications Greatly Simplifies Integration of Wi-Fi® and Bluetooth® in Mobile Phones
The SST12LF02 Integrates Several Passive and Active Components in One Low-Profile Package to Reduce Size and Cost While Maintaining Performance and Functionality
NEWS RELEASE
Editorial Contact:
Eric Lawson
480/792-7182
eric.lawson@microchip.com
SUNNYVALE, Calif., JUNE 7, 2010 — SST Communications, Corp., a wholly owned subsidiary of Silicon Storage Technology, Inc., today announced a new RF front-end module solution that makes it easier for system designers to reduce the footprint of Wi-Fi® and Bluetooth® functionality in mobile phones. The SST12LF02 integrates key RF components, including a power amplifier (PA), antenna switch and filters, in a single compact module that significantly reduces the size and lowers the bill-of-materials cost when compared to alternative design approaches that can use up to 10 discrete components.
The trend of handset manufacturers offering Wi-Fi connectivity and Bluetooth in their handsets has been growing steadily over the past year, as evidenced by the rising popularity of smartphone devices. Currently, smartphones account for 14 percent of overall mobile device sales, but Gartner expects by 2012 they will make up around 37 percent of global handset sales.* The SST12LF02 front-end module supports this trend by integrating a high-linearity, high-efficiency 802.11 b/g/n PA, along with a single-pole-three-throw (SP3T) switch and several supporting passive components into a compact 3 x 3 x 0.5mm package, thus not only simplifying the front-end circuit designs for the Wi-Fi/Bluetooth radios but also allowing the radios to share a single antenna.
Also integrated in the SST12LF02 is a harmonic trap filter and noise reduction filters to eliminate interference with the mobile-phone radio. All RF ports on the SST12LF02 are DC blocked and matched to 50 Ohms, which simplifies the design and minimizes the external component count. Because of its high level of integration, the SST12LF02 requires only two external components, whereas discrete front-end implementations can require up to 10 components to build a complete solution.
According to Daniel Chow, president, SST Communications, "The SST12LF02 provides a highly integrated Wi-Fi/Bluetooth front-end module for mobile phones that reduces board space and power consumption without sacrificing the performance and functionality that our customers demand. SST Communications has been a premier high-volume supplier of PAs to the Wi-Fi industry since 2002, and our expertise in RF front-end design has enabled us to develop a product with superior linearity, lower DC current consumption and fewer external components than other front-end modules on the market today."
Pricing and Availability
The SST12LF02 front-end module is available now in volume production. The module is priced at $0.41 each in 10,000-unit quantities.
About SST Communications
SST Communications, Corp., a wholly owned subsidiary of Silicon Storage Technology, Inc., is a fabless semiconductor company providing optimized RF solutions to enable wireless multimedia and broadband networking system applications. SST Communications designs RF power amplifiers and other front-end components with a high level of integration, high performance and superb production readiness to facilitate high yield for wireless module/system manufacturers. The company has offices in Los Angeles, California and Taipei, Taiwan.
For more information about SST and the company’s comprehensive list of product offerings, please call 1-888/SST-CHIP. Information can also be requested via email to literature@sst.com or through SST’s Web site at http://www.sst.com.
The SST logo is a registered trademark of Silicon Storage Technology, Inc. All other trademarks or registered trademarks are the property of their respective holders.
*Dataquest Insight: PC Vendors' Move into the Smartphone Market is Not Challenge Free, September 30, 2009
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