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SST34WA1601
16 Mbit Burst Mode Concurrent SuperFlash Memory

The SST34WA1601 is a 16 Mbit (1 Mbit x16) Flash memory device, with Burst Mode data access, that utilizes a single 1.8 V supply. When Supervoltage VH (11.4V to 12V) is applied to the ACC pin, eight word programming is enabled for faster manufacturing-environment programming.

The device features a 256 KWord uniform multi-bank architecture that consists of four banks. The top or bottom banks each contain seven standard 32 KWord blocks and four parameter 8 KWord blocks for added granularity. The remaining two banks each contain uniform 32 KWord blocks. Each 32 KWord block is further divided into sixteen uniform 2 KWord sectors. Blocks and sectors are individually erasable for increased flexibility. Any bank can be read while another bank is being erased or programmed, with zero latency.

The SST34WA1601 supports an Erase-Suspend mode during which data can be programmed to, or read from, any sector or block that is not being erased.

The SST34WA1601 supports synchronous Burst mode read from any address location of the memory array. The Burst mode allows sequential data set reading with significantly shorter latency delays than during a random read, including 8-, 16-, 32-words or continuous or without wrap-around.

The device offers an expanded Block Locking scheme for data protection against any writes. Each block can be individually locked. Additionally, the top or bottom 8 KWord parameter blocks can be individually locked for finer granularity of the top or bottom boot blocks.

A 136-words Security ID, included on the device, increases system design security. The Security ID is divided into two segments: an 8-word, 128-bit segment factory programmed with a SST Unique ID, and a 128- word segment that can be programmed and locked by the user. When not locked, the user programmable bits can be programmed but never erased.

Designed, manufactured, and tested for applications requiring low power and small form factor the SST34WA1601 is offered in an extended temperature with a small footprint package to meet board space constraint requirements.

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