The Micro-Package is offered in four different configurations:

MM Package Code (WFBGA)	M2Q Package Code (WFBGA)	M1Q Package Code (WFBGA)	C1Q Package Code (XFLGA)
34 contacts	48 contacts	48 contacts	48 contacts
4mm x 6mm footprint	5mm x 6mm footprint	4mm x 6mm footprint	4mm x 6mm footprint
0.5mm ball pitch	0.5mm ball pitch	0.5mm ball pitch	0.5mm bump pitch
0.73mm max total height	0.73mm max total height	0.73mm max total height	0.52mm max total height
BGA-style balls	BGA-style balls	BGA-style balls	Uses land grid array (i.e. bumps)

 

Products Now Available:

Device	SST Package Code	Non-Pb RoHS Compliant Option
SST39VF800A	M1Q, C1Q	Yes
SST39WF800A	M2Q	Yes
SST39VF400A	M1Q, C1Q	Yes
SST39WF400A	M1Q, C1Q	Yes
SST39VF200A	M1Q	Yes
SST39LF020	MM	Yes
SST39LF010	MM	Yes

Temperature range for all products: -40ºC to +85ºC