SUNNYVALE, Calif., May 5, 2005 -- SST (Silicon Storage Technology, Inc., NASDAQ: SSTI), a leader in flash memory technology, offers a wide range of flash products in the industry's smallest and thinnest profiles. SST is able to achieve this flexibility by combining its power and size-efficient SuperFlash technology with state-of-the-art packaging technologies. SST's Micro-Packages are optimized for space-restricted applications such as Bluetooth modules and mobile devices like MP3 players, in which size is of critical importance.

These packages are at the forefront of transforming designs for flash memory products. Available in 4 mm x 6 mm and 5 mm x 6 mm dimensions, as well as 34 and 48-contact footprints, SST's Micro-Packages also range in the height factor: in addition to the 0.73-mm-height standard Ball Grid Array, there is a 0.52-mm-height Land Grid Array form factor, which has solder lands or bumps instead of balls. Currently, SST offers its Micro-Package solutions in densities ranging from 1 to 8 Mbit, and soon 16 and 32 Mbit. Both 3.3V and low-power 1.8V options are available, as well as the conventional tin/lead (Sn/Pb) solder and RoHS compliant lead-free (non-Pb) solder for customers creating environmentally friendly products. (A complete list of SST Micro-package configurations and features is organized in the two tables below.)

The lightweight Micro-Packages provide the thinnest flash packages and, in most densities, also the smallest platform size available in the flash industry today. These packaging options enable system designers to significantly shrink their products without sacrificing the footprint compatibility, density scalability, and manufacturing simplicity that their designs require. Occupying 24 square millimeters of board space, the Micro-Package solutions are 50 percent smaller than even SST's industry-leading 6 mm x 8 mm BGA packages. In addition, SST's Micro-Packages both have the same 0.5 mm contact pitch and the same pin outs spanning all the low density products.

This density-independent pin out means that customers can easily migrate device density, get to market more quickly, and take advantage of any future die shrinks or other cost reductions without redesigning their board-level products. For customers looking for the ultimate thin package, the XFLGA package, at 0.52 mm maximum height, is equivalent in height to non-back-grinded die. Yet because it is in a molded package, rework and other manufacturing handling issues can be easily addressed.

Many companies are finding that SST's Micro-Packages especially well-suited to serve mobile module requirements, where overall device height is usually restricted to 2 mm. Designers typically have employed bare-die solutions to meet height constraints. But in order to achieve small form factors with fragile bare die, designers have risked product integrity due to damage that may occur with handling, testing, board rework, and storage of bumped dice. Tochigi Mitsumi, a leading developer of Bluetooth module products, acknowledges the convenient solution SST's Micro-Packages provide. Mr. Kazuo Yoshinaga, Chief Manager of Engineering at Tochigi Mitsumi, says, "SST's XFLGA Micro-Package allows us to use a standard package for our tiny Bluetooth modules instead of a die-based solution, saving us engineering time, manufacturing cost, and ensuring better quality."

Since the introduction of its Micro-Packages in its MPF (Multi-Purpose Flash) family product line in year 2002, SST has been driving the miniaturization of mobile products without the cost and complexities associated with other options. Customers can now offer multiple flash density options for different market segments using a single PC board, while significantly reducing both design and manufacturing cost relative to bare die or other package alternatives.

SST Micro-Packages: You know size matters.

About SuperFlash Technology
SST's SuperFlash technology is a NOR type, split-gate cell architecture which uses a reliable thick-oxide process with fewer manufacturing steps resulting in a low-cost, nonvolatile memory solution with excellent data retention and higher reliability. The split-gate NOR SuperFlash architecture facilitates a simple and flexible design suitable for high performance, high reliability, small or medium sector size, in- or off-system programming and a variety of densities, all in a single CMOS-compatible technology.

About Silicon Storage Technology, Inc.
Headquartered in Sunnyvale, California, SST designs, manufactures and markets a diversified range of nonvolatile memory solutions, based on proprietary, patented SuperFlash technology, for high volume applications in the digital consumer, networking, wireless communications and Internet computing markets. SST's product families include various densities of high functionality flash memory components, flash mass storage products and flash microcontrollers. SST also offers its SuperFlash technology for embedded applications through its world-class manufacturing partners and technology licensees including 1st Silicon (Malaysia) Sdn. Bhd., Freescale Semiconductor, Inc., Grace Semiconductor Manufacturing Corporation (Grace), IBM, National Semiconductor Corporation, NEC Corporation, Oki Electric Industry Co. Ltd., Powerchip Semiconductor Corp., Samsung Electronics Co. Ltd., SANYO Electric Co., Ltd., Seiko Epson Corp., Shanghai Hua Hong NEC Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Toshiba Corporation, Vanguard International Semiconductor Corporation and Winbond Electronics Corp. TSMC offers embedded SuperFlash under its trademark Emb-FLASH. Further information on SST can be found on the company's Web site at http://www.sst.com.